Sd650 Firmware
by Qualcomm
CVEs (333)
| CVE | Vendor / Product | Sev | Risk | CVSS | EPSS | KEV | Published | Description |
|---|---|---|---|---|---|---|---|---|
| CVE-2018-11967 | Hig | 0.51 | 7.8 | 0.00 | May 24, 2019 | Signature verification of the skel library could potentially be disabled as the memory region on the remote subsystem in which the library is loaded is allocated from userspace currently in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT,… | ||
| CVE-2017-18279 | Hig | 0.51 | 7.8 | 0.00 | May 6, 2019 | Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880,… | ||
| CVE-2017-18278 | Hig | 0.51 | 7.8 | 0.00 | May 6, 2019 | An integer underflow may occur due to lack of check when received data length from font_mgr_qsee_request_service is bigger than the minimal value of the segment header, which may result in a buffer overflow, in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in… | ||
| CVE-2017-18274 | Hig | 0.51 | 7.8 | 0.00 | May 6, 2019 | While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in… | ||
| CVE-2017-18157 | Hig | 0.51 | 7.8 | 0.00 | May 6, 2019 | A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845,… | ||
| CVE-2018-11966 | Hig | 0.51 | 7.8 | 0.00 | Apr 4, 2019 | Undefined behavior in UE while processing unknown IEI in OTA message in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU,… | ||
| CVE-2018-13913 | Hig | 0.51 | 7.8 | 0.00 | Feb 25, 2019 | Improper validation of array index can lead to unauthorized access while processing debugFS in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in version MDM9150, MDM9206,… | ||
| CVE-2018-11938 | Hig | 0.51 | 7.8 | 0.00 | Feb 25, 2019 | Improper input validation for argument received from HLOS can lead to buffer overflows and unexpected behavior in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT,… | ||
| CVE-2018-11931 | Hig | 0.51 | 7.8 | 0.00 | Feb 25, 2019 | Improper access to HLOS is possible while transferring memory to CPZ in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in… | ||
| CVE-2018-11289 | Hig | 0.51 | 7.8 | 0.00 | Feb 25, 2019 | Data truncation during higher to lower type conversion which causes less memory allocation than desired can lead to a buffer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT,… | ||
| CVE-2018-13888 | Hig | 0.51 | 7.8 | 0.00 | Feb 11, 2019 | There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607,… | ||
| CVE-2018-11899 | Hig | 0.51 | 7.8 | 0.00 | Feb 11, 2019 | While processing radio connection status change events, Radio index is not properly validated in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile and Snapdragon Voice & Music in versions MDM9206, MDM9607, MDM9640,… | ||
| CVE-2018-11888 | Hig | 0.51 | 7.8 | 0.00 | Feb 11, 2019 | Unauthorized access may be allowed by the SCP11 Crypto Services TA will processing commands from other TA in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon… | ||
| CVE-2018-11847 | Hig | 0.51 | 7.8 | 0.00 | Feb 11, 2019 | Malicious TA can tag QSEE kernel memory and map to EL0, there by corrupting the physical memory as well it can be used to corrupt the QSEE kernel and compromise the whole TEE in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics… | ||
| CVE-2018-5867 | Hig | 0.51 | 7.8 | 0.00 | Jan 18, 2019 | Lack of checking input size can lead to buffer overflow In WideVine in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD… | ||
| CVE-2017-8276 | Hig | 0.51 | 7.8 | 0.00 | Jan 18, 2019 | Improper authorization involving a fuse in TrustZone in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD… | ||
| CVE-2017-18330 | Hig | 0.51 | 7.8 | 0.00 | Jan 3, 2019 | Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425,… | ||
| CVE-2017-18329 | Hig | 0.51 | 7.8 | 0.00 | Jan 3, 2019 | Possible Buffer overflow when transmitting an RTP packet in snapdragon automobile and snapdragon wear in versions MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415,… | ||
| CVE-2017-18320 | Hig | 0.51 | 7.8 | 0.00 | Jan 3, 2019 | QSEE unload attempt on a 3rd party TEE without previously loading results in a data abort in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD… | ||
| CVE-2017-18141 | Hig | 0.51 | 7.8 | 0.00 | Jan 3, 2019 | When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions… |
- risk 0.51cvss 7.8epss 0.00
Signature verification of the skel library could potentially be disabled as the memory region on the remote subsystem in which the library is loaded is allocated from userspace currently in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT,…
- risk 0.51cvss 7.8epss 0.00
Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880,…
- risk 0.51cvss 7.8epss 0.00
An integer underflow may occur due to lack of check when received data length from font_mgr_qsee_request_service is bigger than the minimal value of the segment header, which may result in a buffer overflow, in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in…
- risk 0.51cvss 7.8epss 0.00
While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in…
- risk 0.51cvss 7.8epss 0.00
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845,…
- risk 0.51cvss 7.8epss 0.00
Undefined behavior in UE while processing unknown IEI in OTA message in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU,…
- risk 0.51cvss 7.8epss 0.00
Improper validation of array index can lead to unauthorized access while processing debugFS in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in version MDM9150, MDM9206,…
- risk 0.51cvss 7.8epss 0.00
Improper input validation for argument received from HLOS can lead to buffer overflows and unexpected behavior in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT,…
- risk 0.51cvss 7.8epss 0.00
Improper access to HLOS is possible while transferring memory to CPZ in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in…
- risk 0.51cvss 7.8epss 0.00
Data truncation during higher to lower type conversion which causes less memory allocation than desired can lead to a buffer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT,…
- risk 0.51cvss 7.8epss 0.00
There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607,…
- risk 0.51cvss 7.8epss 0.00
While processing radio connection status change events, Radio index is not properly validated in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile and Snapdragon Voice & Music in versions MDM9206, MDM9607, MDM9640,…
- risk 0.51cvss 7.8epss 0.00
Unauthorized access may be allowed by the SCP11 Crypto Services TA will processing commands from other TA in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon…
- risk 0.51cvss 7.8epss 0.00
Malicious TA can tag QSEE kernel memory and map to EL0, there by corrupting the physical memory as well it can be used to corrupt the QSEE kernel and compromise the whole TEE in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics…
- risk 0.51cvss 7.8epss 0.00
Lack of checking input size can lead to buffer overflow In WideVine in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD…
- risk 0.51cvss 7.8epss 0.00
Improper authorization involving a fuse in TrustZone in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD…
- risk 0.51cvss 7.8epss 0.00
Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425,…
- risk 0.51cvss 7.8epss 0.00
Possible Buffer overflow when transmitting an RTP packet in snapdragon automobile and snapdragon wear in versions MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415,…
- risk 0.51cvss 7.8epss 0.00
QSEE unload attempt on a 3rd party TEE without previously loading results in a data abort in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD…
- risk 0.51cvss 7.8epss 0.00
When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions…
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