High severity7.8NVD Advisory· Published May 6, 2019· Updated Jun 17, 2026
CVE-2017-18279
CVE-2017-18279
Description
Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016.
Affected products
41- cpe:2.3:o:qualcomm:fsm9055_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fsm9955_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ipq4019_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ipq8064_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9531_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9558_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9563_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9880_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9886_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca9980_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_800_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*
- Qualcomm Technologies, Inc./Small Cell SoC, Snapdragon Mobile, Snapdragon Wearv5Range: FSM9055
Patches
Vulnerability mechanics
References
1- www.qualcomm.com/company/product-security/bulletinsnvdVendor Advisory
News mentions
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