Unrated severityNVD Advisory· Published May 6, 2019· Updated Aug 5, 2024
CVE-2017-18157
CVE-2017-18157
Description
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Affected products
4- Qualcomm Technologies, Inc./Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wearv5Range: MDM9206
Patches
Vulnerability mechanics
References
1- www.qualcomm.com/company/product-security/bulletinsmitrex_refsource_CONFIRM
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