Qcn7606 Firmware
by Qualcomm
CVEs (166)
| CVE | Vendor / Product | Sev | Risk | CVSS | EPSS | KEV | Published | Description |
|---|---|---|---|---|---|---|---|---|
| CVE-2020-11269 | Hig | 0.57 | 8.8 | 0.00 | Feb 22, 2021 | Possible memory corruption while processing EAPOL frames due to lack of validation of key length before using it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT,… | ||
| CVE-2020-11155 | Hig | 0.57 | 8.8 | 0.01 | Nov 2, 2020 | u'Buffer overflow while processing PDU packet in bluetooth due to lack of check of buffer length before copying into it.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial… | ||
| CVE-2020-11154 | Hig | 0.57 | 8.8 | 0.01 | Nov 2, 2020 | u'Buffer overflow while processing a crafted PDU data packet in bluetooth due to lack of check of buffer size before copying' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon… | ||
| CVE-2024-21461 | Hig | 0.55 | 8.4 | 0.00 | Jul 1, 2024 | Memory corruption while performing finish HMAC operation when context is freed by keymaster. | ||
| CVE-2023-33023 | Hig | 0.55 | 8.4 | 0.00 | Apr 1, 2024 | Memory corruption while processing finish_sign command to pass a rsp buffer. | ||
| CVE-2023-28547 | Hig | 0.55 | 8.4 | 0.00 | Apr 1, 2024 | Memory corruption in SPS Application while requesting for public key in sorter TA. | ||
| CVE-2023-33088 | Hig | 0.55 | 8.4 | 0.00 | Dec 5, 2023 | Memory corruption when processing cmd parameters while parsing vdev. | ||
| CVE-2023-33022 | Hig | 0.55 | 8.4 | 0.00 | Dec 5, 2023 | Memory corruption in HLOS while invoking IOCTL calls from user-space. | ||
| CVE-2023-24852 | Hig | 0.55 | 8.4 | 0.00 | Nov 7, 2023 | Memory Corruption in Core due to secure memory access by user while loading modem image. | ||
| CVE-2023-28538 | Hig | 0.55 | 8.4 | 0.00 | Sep 5, 2023 | Memory corruption in WIN Product while invoking WinAcpi update driver in the UEFI region. | ||
| CVE-2023-21628 | Hig | 0.55 | 8.4 | 0.00 | Jun 6, 2023 | Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command. | ||
| CVE-2022-40507 | Hig | 0.55 | 8.4 | 0.01 | Jun 6, 2023 | Memory corruption due to double free in Core while mapping HLOS address to the list. | ||
| CVE-2022-40532 | Hig | 0.55 | 8.4 | 0.00 | Apr 13, 2023 | Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target. | ||
| CVE-2022-40531 | Hig | 0.55 | 8.4 | 0.00 | Mar 10, 2023 | Memory corruption in WLAN due to incorrect type cast while sending WMI_SCAN_SCH_PRIO_TBL_CMDID message. | ||
| CVE-2022-40530 | Hig | 0.55 | 8.4 | 0.00 | Mar 10, 2023 | Memory corruption in WLAN due to integer overflow to buffer overflow in WLAN during initialization phase. | ||
| CVE-2022-33277 | Hig | 0.55 | 8.4 | 0.00 | Feb 12, 2023 | Memory corruption in modem due to buffer copy without checking size of input while receiving WMI command. | ||
| CVE-2022-40517 | Hig | 0.55 | 8.4 | 0.00 | Jan 9, 2023 | Memory corruption in core due to stack-based buffer overflow | ||
| CVE-2022-40516 | Hig | 0.55 | 8.4 | 0.01 | Jan 9, 2023 | Memory corruption in Core due to stack-based buffer overflow. | ||
| CVE-2022-33214 | Hig | 0.55 | 8.4 | 0.00 | Oct 19, 2022 | Memory corruption in display due to time-of-check time-of-use of metadata reserved size in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | ||
| CVE-2022-22058 | Hig | 0.55 | 8.4 | 0.00 | Sep 26, 2022 | Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon… |
- risk 0.57cvss 8.8epss 0.00
Possible memory corruption while processing EAPOL frames due to lack of validation of key length before using it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT,…
- risk 0.57cvss 8.8epss 0.01
u'Buffer overflow while processing PDU packet in bluetooth due to lack of check of buffer length before copying into it.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial…
- risk 0.57cvss 8.8epss 0.01
u'Buffer overflow while processing a crafted PDU data packet in bluetooth due to lack of check of buffer size before copying' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon…
- risk 0.55cvss 8.4epss 0.00
Memory corruption while performing finish HMAC operation when context is freed by keymaster.
- risk 0.55cvss 8.4epss 0.00
Memory corruption while processing finish_sign command to pass a rsp buffer.
- risk 0.55cvss 8.4epss 0.00
Memory corruption in SPS Application while requesting for public key in sorter TA.
- risk 0.55cvss 8.4epss 0.00
Memory corruption when processing cmd parameters while parsing vdev.
- risk 0.55cvss 8.4epss 0.00
Memory corruption in HLOS while invoking IOCTL calls from user-space.
- risk 0.55cvss 8.4epss 0.00
Memory Corruption in Core due to secure memory access by user while loading modem image.
- risk 0.55cvss 8.4epss 0.00
Memory corruption in WIN Product while invoking WinAcpi update driver in the UEFI region.
- risk 0.55cvss 8.4epss 0.00
Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command.
- risk 0.55cvss 8.4epss 0.01
Memory corruption due to double free in Core while mapping HLOS address to the list.
- risk 0.55cvss 8.4epss 0.00
Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target.
- risk 0.55cvss 8.4epss 0.00
Memory corruption in WLAN due to incorrect type cast while sending WMI_SCAN_SCH_PRIO_TBL_CMDID message.
- risk 0.55cvss 8.4epss 0.00
Memory corruption in WLAN due to integer overflow to buffer overflow in WLAN during initialization phase.
- risk 0.55cvss 8.4epss 0.00
Memory corruption in modem due to buffer copy without checking size of input while receiving WMI command.
- risk 0.55cvss 8.4epss 0.00
Memory corruption in core due to stack-based buffer overflow
- risk 0.55cvss 8.4epss 0.01
Memory corruption in Core due to stack-based buffer overflow.
- risk 0.55cvss 8.4epss 0.00
Memory corruption in display due to time-of-check time-of-use of metadata reserved size in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
- risk 0.55cvss 8.4epss 0.00
Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon…
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