VYPR

Qcn7606 Firmware

by Qualcomm

CVEs (102)

  • CVE-2023-28550HigDec 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in MPP performance while accessing DSM watermark using external memory address.

  • CVE-2023-28546HigDec 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory Corruption in SPS Application while exporting public key in sorter TA.

  • CVE-2023-24850HigOct 3, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory Corruption in HLOS while importing a cryptographic key into KeyMaster Trusted Application.

  • CVE-2023-28565HigSep 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in WLAN HAL while handling command streams through WMI interfaces.

  • CVE-2023-28560HigSep 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload.

  • CVE-2023-28559HigSep 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in WLAN FW while processing command parameters from untrusted WMI payload.

  • CVE-2023-28558HigSep 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in WLAN handler while processing PhyID in Tx status handler.

  • CVE-2023-28557HigSep 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in WLAN HAL while processing command parameters from untrusted WMI payload.

  • CVE-2023-28544HigSep 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in WLAN while sending transmit command from HLOS to UTF handlers.

  • CVE-2023-28541HigJul 4, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory Corruption in Data Modem while processing DMA buffer release event about CFR data.

  • CVE-2021-30303HigJan 3, 2022
    risk 0.51cvss 7.8epss 0.00

    Possible buffer overflow due to lack of buffer length check when segmented WMI command is received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon…

  • CVE-2019-10527HigSep 8, 2020
    risk 0.51cvss 7.8epss 0.00

    u'SMEM partition can be manipulated in case of any compromise on HLOS, thus resulting in access to memory outside of SMEM address range which could lead to memory corruption' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics…

  • CVE-2019-14037HigJul 30, 2020
    risk 0.51cvss 7.8epss 0.00

    Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon…

  • CVE-2023-21652HigAug 8, 2023
    risk 0.50cvss 7.7epss 0.00

    Cryptographic issue in HLOS as derived keys used to encrypt/decrypt information is present on stack after use.

  • CVE-2025-27066HigAug 6, 2025
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while processing an ANQP message.

  • CVE-2024-33051HigSep 2, 2024
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while processing TIM IE from beacon frame as there is no check for IE length.

  • CVE-2023-43536HigFeb 6, 2024
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while parse fils IE with length equal to 1.

  • CVE-2023-43512HigJan 2, 2024
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while parsing GATT service data when the total amount of memory that is required by the multiple services is greater than the actual size of the services buffer.

  • CVE-2023-43511HigJan 2, 2024
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while parsing IPv6 extension header when WLAN firmware receives an IPv6 packet that contains `IPPROTO_NONE` as the next header.

  • CVE-2023-33062HigJan 2, 2024
    risk 0.49cvss 7.5epss 0.00

    Transient DOS in WLAN Firmware while parsing a BTM request.

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