High severity8.8NVD Advisory· Published Nov 2, 2020· Updated Jun 17, 2026
CVE-2020-11154
CVE-2020-11154
Description
u'Buffer overflow while processing a crafted PDU data packet in bluetooth due to lack of check of buffer size before copying' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, QCA6390, QCN7605, QCN7606, SA415M, SA515M, SA6155P, SA8155P, SC8180X, SDX55
Affected products
13- cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn7605_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn7606_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa415m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa515m_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*+ 1 more
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- Qualcomm, Inc./Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networkingv5Range: APQ8009, APQ8053, QCA6390, QCN7605, QCN7606, SA415M, SA515M, SA6155P, SA8155P, SC8180X, SDX55
Patches
Vulnerability mechanics
References
2News mentions
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