VYPR

Wcn7851 Firmware

by Qualcomm

CVEs (184)

  • CVE-2022-33284HigJan 9, 2023
    risk 0.53cvss 8.2epss 0.00

    Information disclosure due to buffer over-read in WLAN while parsing BTM action frame.

  • CVE-2022-33283HigJan 9, 2023
    risk 0.53cvss 8.2epss 0.00

    Information disclosure due to buffer over-read in WLAN while WLAN frame parsing due to missing frame length check.

  • CVE-2022-33255HigJan 9, 2023
    risk 0.53cvss 8.2epss 0.00

    Information disclosure due to buffer over-read in Bluetooth HOST while processing GetFolderItems and GetItemAttribute Cmds from peer device.

  • CVE-2022-33252HigJan 9, 2023
    risk 0.53cvss 8.2epss 0.00

    Information disclosure due to buffer over-read in WLAN while handling IBSS beacons frame.

  • CVE-2022-25746HigJan 9, 2023
    risk 0.53cvss 8.1epss 0.00

    Memory corruption in kernel due to missing checks when updating the access rights of a memextent mapping.

  • CVE-2022-33268HigDec 13, 2022
    risk 0.53cvss 8.2epss 0.00

    Information disclosure due to buffer over-read in Bluetooth HOST while pairing and connecting A2DP. in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

  • CVE-2022-33235HigDec 13, 2022
    risk 0.53cvss 8.2epss 0.00

    Information disclosure due to buffer over-read in WLAN firmware while parsing security context info attributes. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT,…

  • CVE-2022-25706HigSep 16, 2022
    risk 0.53cvss 8.2epss 0.00

    Information disclosure in Bluetooth driver due to buffer over-read while reading l2cap length in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables

  • CVE-2022-22062HigSep 2, 2022
    risk 0.53cvss 8.2epss 0.00

    An out-of-bounds read can occur while parsing a server certificate due to improper length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT,…

  • CVE-2021-35083HigJun 14, 2022
    risk 0.53cvss 8.2epss 0.01

    Possible out of bound read due to improper validation of certificate chain in SSL or Internet key exchange in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT,…

  • CVE-2025-21476HigSep 24, 2025
    risk 0.51cvss 7.8epss 0.00

    Memory corruption when passing parameters to the Trusted Virtual Machine during the handshake.

  • CVE-2023-21664HigSep 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory Corruption in Core Platform while printing the response buffer in log.

  • CVE-2023-21662HigSep 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in Core Platform while printing the response buffer in log.

  • CVE-2022-33278HigMar 10, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity.

  • CVE-2022-33242HigMar 10, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption due to improper authentication in Qualcomm IPC while loading unsigned lib in audio PD.

  • CVE-2022-25705HigMar 10, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in modem due to integer overflow to buffer overflow while handling APDU response

  • CVE-2022-33248HigFeb 12, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in User Identity Module due to integer overflow to buffer overflow when a segement is received via qmi http.

  • CVE-2022-33233HigFeb 12, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption due to configuration weakness in modem wile sending command to write protected files.

  • CVE-2022-33217HigOct 19, 2022
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. in Snapdragon Mobile

  • CVE-2022-25660HigOct 19, 2022
    risk 0.51cvss 7.8epss 0.00

    Memory corruption due to double free issue in kernel in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile

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