High severity7.8NVD Advisory· Published Oct 19, 2022· Updated Jun 17, 2026
CVE-2022-33217
CVE-2022-33217
Description
Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. in Snapdragon Mobile
Affected products
10- cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6855_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6856_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn7850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn7851_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
- Qualcomm, Inc./Snapdragon Mobilev5Range: SD 8 Gen1 5G, WCD9380, WCN6855, WCN6856, WCN7850, WCN7851, WSA8830, WSA8835
Patches
Vulnerability mechanics
References
1News mentions
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