VYPR

Qca2066 Firmware

by Qualcomm

CVEs (112)

  • CVE-2024-43050HigDec 2, 2024
    risk 0.51cvss 7.8epss 0.00

    Memory corruption while invoking IOCTL calls from user space to issue factory test command inside WLAN driver.

  • CVE-2023-28587HigDec 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level.

  • CVE-2023-28550HigDec 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in MPP performance while accessing DSM watermark using external memory address.

  • CVE-2023-28573HigSep 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in WLAN HAL while parsing WMI command parameters.

  • CVE-2023-28567HigSep 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in WLAN HAL while handling command through WMI interfaces.

  • CVE-2023-28558HigSep 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in WLAN handler while processing PhyID in Tx status handler.

  • CVE-2023-28557HigSep 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in WLAN HAL while processing command parameters from untrusted WMI payload.

  • CVE-2023-28549HigSep 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in WLAN HAL while parsing Rx buffer in processing TLV payload.

  • CVE-2023-28548HigSep 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in WLAN HAL while processing Tx/Rx commands from QDART.

  • CVE-2021-35129HigJun 14, 2022
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in BT controller due to improper length check while processing vendor specific commands in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure…

  • CVE-2021-30303HigJan 3, 2022
    risk 0.51cvss 7.8epss 0.00

    Possible buffer overflow due to lack of buffer length check when segmented WMI command is received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon…

  • CVE-2026-25292HigAug 4, 2026
    risk 0.49cvss 7.6epss 0.00

    Memory Corruption when processing untrusted user input in the fastboot command handler for audio framework configuration.

  • CVE-2025-47318HigSep 24, 2025
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while parsing the EPTM test control message to get the test pattern.

  • CVE-2025-27066HigAug 6, 2025
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while processing an ANQP message.

  • CVE-2025-21446HigJul 8, 2025
    risk 0.49cvss 7.5epss 0.00

    Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests.

  • CVE-2025-21448HigApr 7, 2025
    risk 0.49cvss 7.5epss 0.00

    Transient DOS may occur while parsing SSID in action frames.

  • CVE-2024-33051HigSep 2, 2024
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while processing TIM IE from beacon frame as there is no check for IE length.

  • CVE-2024-23364HigSep 2, 2024
    risk 0.49cvss 7.5epss 0.00

    Transient DOS when processing the non-transmitted BSSID profile sub-elements present within the MBSSID Information Element (IE) of a beacon frame that is received from over-the-air (OTA).

  • CVE-2023-43536HigFeb 6, 2024
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while parse fils IE with length equal to 1.

  • CVE-2023-43533HigFeb 6, 2024
    risk 0.49cvss 7.5epss 0.00

    Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame.

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