Sd 8 Gen1 5g Firmware
by Qualcomm
CVEs (431)
| CVE | Vendor / Product | Sev | Risk | CVSS | EPSS | KEV | Published | Description |
|---|---|---|---|---|---|---|---|---|
| CVE-2021-35103 | Hig | 0.51 | 7.8 | 0.00 | Apr 1, 2022 | Possible out of bound write due to improper validation of number of timer values received from firmware while syncing timers in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired… | ||
| CVE-2021-30333 | Hig | 0.51 | 7.8 | 0.00 | Apr 1, 2022 | Improper validation of buffer size input to the EFS file can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | ||
| CVE-2021-35069 | Hig | 0.51 | 7.8 | 0.00 | Feb 11, 2022 | Improper validation of data length received from DMA buffer can lead to memory corruption. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired… | ||
| CVE-2021-30322 | Hig | 0.51 | 7.8 | 0.00 | Feb 11, 2022 | Possible out of bounds write due to improper validation of number of GPIOs configured in an internal parameters array in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | ||
| CVE-2021-30319 | Hig | 0.51 | 7.8 | 0.00 | Jan 13, 2022 | Possible integer overflow due to improper validation of command length parameters while processing WMI command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT,… | ||
| CVE-2021-30311 | Hig | 0.51 | 7.8 | 0.00 | Jan 13, 2022 | Possible heap overflow due to lack of index validation before allocating and writing to heap buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | ||
| CVE-2021-30308 | Hig | 0.51 | 7.8 | 0.00 | Jan 13, 2022 | Possible buffer overflow while printing the HARQ memory partition detail due to improper validation of buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | ||
| CVE-2024-45549 | Hig | 0.50 | 7.7 | 0.00 | Apr 7, 2025 | Information disclosure while creating MQ channels. | ||
| CVE-2023-21652 | Hig | 0.50 | 7.7 | 0.00 | Aug 8, 2023 | Cryptographic issue in HLOS as derived keys used to encrypt/decrypt information is present on stack after use. | ||
| CVE-2021-35116 | Hig | 0.50 | 7.7 | 0.00 | Jun 14, 2022 | APK can load a crafted model into the CDSP which can lead to a compromise of CDSP and other APK`s data executing there in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | ||
| CVE-2026-24084 | Hig | 0.49 | 7.5 | 0.00 | Aug 4, 2026 | Weak configuration when UE does not verify the consistency of its additional security capabilities with the replayed capabilities. | ||
| CVE-2026-21367 | Hig | 0.49 | 7.6 | 0.00 | Apr 6, 2026 | Transient DOS when processing nonstandard FILS Discovery Frames with out-of-range action sizes during initial scans. | ||
| CVE-2025-47318 | Hig | 0.49 | 7.5 | 0.00 | Sep 24, 2025 | Transient DOS while parsing the EPTM test control message to get the test pattern. | ||
| CVE-2025-27073 | Hig | 0.49 | 7.5 | 0.00 | Aug 6, 2025 | Transient DOS while creating NDP instance. | ||
| CVE-2025-27066 | Hig | 0.49 | 7.5 | 0.00 | Aug 6, 2025 | Transient DOS while processing an ANQP message. | ||
| CVE-2025-27065 | Hig | 0.49 | 7.5 | 0.00 | Aug 6, 2025 | Transient DOS while processing a frame with malformed shared-key descriptor. | ||
| CVE-2025-21454 | Hig | 0.49 | 7.5 | 0.00 | Jul 8, 2025 | Transient DOS while processing received beacon frame. | ||
| CVE-2025-21449 | Hig | 0.49 | 7.5 | 0.00 | Jul 8, 2025 | Transient DOS may occur while processing malformed length field in SSID IEs. | ||
| CVE-2025-21446 | Hig | 0.49 | 7.5 | 0.00 | Jul 8, 2025 | Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests. | ||
| CVE-2025-21448 | Hig | 0.49 | 7.5 | 0.00 | Apr 7, 2025 | Transient DOS may occur while parsing SSID in action frames. |
- risk 0.51cvss 7.8epss 0.00
Possible out of bound write due to improper validation of number of timer values received from firmware while syncing timers in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired…
- risk 0.51cvss 7.8epss 0.00
Improper validation of buffer size input to the EFS file can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
- risk 0.51cvss 7.8epss 0.00
Improper validation of data length received from DMA buffer can lead to memory corruption. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired…
- risk 0.51cvss 7.8epss 0.00
Possible out of bounds write due to improper validation of number of GPIOs configured in an internal parameters array in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
- risk 0.51cvss 7.8epss 0.00
Possible integer overflow due to improper validation of command length parameters while processing WMI command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT,…
- risk 0.51cvss 7.8epss 0.00
Possible heap overflow due to lack of index validation before allocating and writing to heap buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
- risk 0.51cvss 7.8epss 0.00
Possible buffer overflow while printing the HARQ memory partition detail due to improper validation of buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
- risk 0.50cvss 7.7epss 0.00
Information disclosure while creating MQ channels.
- risk 0.50cvss 7.7epss 0.00
Cryptographic issue in HLOS as derived keys used to encrypt/decrypt information is present on stack after use.
- risk 0.50cvss 7.7epss 0.00
APK can load a crafted model into the CDSP which can lead to a compromise of CDSP and other APK`s data executing there in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
- risk 0.49cvss 7.5epss 0.00
Weak configuration when UE does not verify the consistency of its additional security capabilities with the replayed capabilities.
- risk 0.49cvss 7.6epss 0.00
Transient DOS when processing nonstandard FILS Discovery Frames with out-of-range action sizes during initial scans.
- risk 0.49cvss 7.5epss 0.00
Transient DOS while parsing the EPTM test control message to get the test pattern.
- risk 0.49cvss 7.5epss 0.00
Transient DOS while creating NDP instance.
- risk 0.49cvss 7.5epss 0.00
Transient DOS while processing an ANQP message.
- risk 0.49cvss 7.5epss 0.00
Transient DOS while processing a frame with malformed shared-key descriptor.
- risk 0.49cvss 7.5epss 0.00
Transient DOS while processing received beacon frame.
- risk 0.49cvss 7.5epss 0.00
Transient DOS may occur while processing malformed length field in SSID IEs.
- risk 0.49cvss 7.5epss 0.00
Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests.
- risk 0.49cvss 7.5epss 0.00
Transient DOS may occur while parsing SSID in action frames.
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