Sm4350 Firmware
by Qualcomm
CVEs (68)
| CVE | Vendor / Product | Sev | Risk | CVSS | EPSS | KEV | Published | Description |
|---|---|---|---|---|---|---|---|---|
| CVE-2023-33035 | Hig | 0.51 | 7.8 | 0.00 | Oct 3, 2023 | Memory corruption while invoking callback function of AFE from ADSP. | ||
| CVE-2023-28560 | Hig | 0.51 | 7.8 | 0.00 | Sep 5, 2023 | Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload. | ||
| CVE-2023-21670 | Hig | 0.51 | 7.8 | 0.00 | Jun 6, 2023 | Memory Corruption in GPU Subsystem due to arbitrary command execution from GPU in privileged mode. | ||
| CVE-2023-21657 | Hig | 0.51 | 7.8 | 0.00 | Jun 6, 2023 | Memoru corruption in Audio when ADSP sends input during record use case. | ||
| CVE-2023-21656 | Hig | 0.51 | 7.8 | 0.00 | Jun 6, 2023 | Memory corruption in WLAN HOST while receiving an WMI event from firmware. | ||
| CVE-2022-33264 | Hig | 0.51 | 7.9 | 0.00 | Jun 6, 2023 | Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message. | ||
| CVE-2020-11239 | Hig | 0.51 | 7.8 | 0.00 | Jun 9, 2021 | Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon… | ||
| CVE-2020-11178 | Hig | 0.51 | 7.8 | 0.00 | Jun 9, 2021 | Trusted APPS to overwrite the CPZ memory of another use-case as TZ only checks the physical address not overlapping with its memory and its RoT memory in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon… | ||
| CVE-2020-11165 | Hig | 0.51 | 7.8 | 0.00 | Jun 9, 2021 | Memory corruption due to buffer overflow while copying the message provided by HLOS into buffer without validating the length of buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile,… | ||
| CVE-2020-11204 | Hig | 0.51 | 7.8 | 0.00 | Feb 22, 2021 | Possible memory corruption and information leakage in sub-system due to lack of check for validity and boundary compliance for parameters that are read from shared MSG RAM in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon… | ||
| CVE-2020-11195 | Hig | 0.51 | 7.8 | 0.00 | Feb 22, 2021 | Out of bound write and read in TA while processing command from NS side due to improper length check on command and response buffers in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon… | ||
| CVE-2020-11194 | Hig | 0.51 | 7.8 | 0.00 | Feb 22, 2021 | Possible out of bound access in TA while processing a command from NS side due to improper length check of response buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired… | ||
| CVE-2023-33080 | Hig | 0.49 | 7.5 | 0.00 | Dec 5, 2023 | Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. | ||
| CVE-2023-33044 | Hig | 0.49 | 7.5 | 0.01 | Dec 5, 2023 | Transient DOS in Data modem while handling TLB control messages from the Network. | ||
| CVE-2023-33043 | Hig | 0.49 | 7.5 | 0.01 | Dec 5, 2023 | Transient DOS in Modem when a Beam switch request is made with a non-configured BWP. | ||
| CVE-2023-33042 | Hig | 0.49 | 7.5 | 0.01 | Dec 5, 2023 | Transient DOS in Modem after RRC Setup message is received. | ||
| CVE-2023-33027 | Hig | 0.49 | 7.5 | 0.00 | Oct 3, 2023 | Transient DOS in WLAN Firmware while parsing rsn ies. | ||
| CVE-2023-28555 | Hig | 0.49 | 7.5 | 0.00 | Aug 8, 2023 | Transient DOS in Audio while remapping channel buffer in media codec decoding. | ||
| CVE-2023-21659 | Hig | 0.49 | 7.5 | 0.00 | Jun 6, 2023 | Transient DOS in WLAN Firmware while processing frames with missing header fields. | ||
| CVE-2022-40536 | Hig | 0.49 | 7.5 | 0.00 | Jun 6, 2023 | Transient DOS due to improper authentication in modem while receiving plain TLB OTA request message from network. |
- risk 0.51cvss 7.8epss 0.00
Memory corruption while invoking callback function of AFE from ADSP.
- risk 0.51cvss 7.8epss 0.00
Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload.
- risk 0.51cvss 7.8epss 0.00
Memory Corruption in GPU Subsystem due to arbitrary command execution from GPU in privileged mode.
- risk 0.51cvss 7.8epss 0.00
Memoru corruption in Audio when ADSP sends input during record use case.
- risk 0.51cvss 7.8epss 0.00
Memory corruption in WLAN HOST while receiving an WMI event from firmware.
- risk 0.51cvss 7.9epss 0.00
Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message.
- risk 0.51cvss 7.8epss 0.00
Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon…
- risk 0.51cvss 7.8epss 0.00
Trusted APPS to overwrite the CPZ memory of another use-case as TZ only checks the physical address not overlapping with its memory and its RoT memory in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon…
- risk 0.51cvss 7.8epss 0.00
Memory corruption due to buffer overflow while copying the message provided by HLOS into buffer without validating the length of buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile,…
- risk 0.51cvss 7.8epss 0.00
Possible memory corruption and information leakage in sub-system due to lack of check for validity and boundary compliance for parameters that are read from shared MSG RAM in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon…
- risk 0.51cvss 7.8epss 0.00
Out of bound write and read in TA while processing command from NS side due to improper length check on command and response buffers in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon…
- risk 0.51cvss 7.8epss 0.00
Possible out of bound access in TA while processing a command from NS side due to improper length check of response buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired…
- risk 0.49cvss 7.5epss 0.00
Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame.
- risk 0.49cvss 7.5epss 0.01
Transient DOS in Data modem while handling TLB control messages from the Network.
- risk 0.49cvss 7.5epss 0.01
Transient DOS in Modem when a Beam switch request is made with a non-configured BWP.
- risk 0.49cvss 7.5epss 0.01
Transient DOS in Modem after RRC Setup message is received.
- risk 0.49cvss 7.5epss 0.00
Transient DOS in WLAN Firmware while parsing rsn ies.
- risk 0.49cvss 7.5epss 0.00
Transient DOS in Audio while remapping channel buffer in media codec decoding.
- risk 0.49cvss 7.5epss 0.00
Transient DOS in WLAN Firmware while processing frames with missing header fields.
- risk 0.49cvss 7.5epss 0.00
Transient DOS due to improper authentication in modem while receiving plain TLB OTA request message from network.
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