Snapdragon 210 Processor Firmware
by Qualcomm
CVEs (32)
| CVE | Vendor / Product | Sev | Risk | CVSS | EPSS | KEV | Published | Description |
|---|---|---|---|---|---|---|---|---|
| CVE-2023-33017 | Hig | 0.51 | 7.8 | 0.00 | Dec 5, 2023 | Memory corruption in Boot while running a ListVars test in UEFI Menu during boot. | ||
| CVE-2023-28550 | Hig | 0.51 | 7.8 | 0.00 | Dec 5, 2023 | Memory corruption in MPP performance while accessing DSM watermark using external memory address. | ||
| CVE-2023-33031 | Hig | 0.51 | 7.8 | 0.00 | Nov 7, 2023 | Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer. | ||
| CVE-2025-21430 | Hig | 0.49 | 7.5 | 0.00 | Apr 7, 2025 | Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session. | ||
| CVE-2025-21429 | Hig | 0.49 | 7.5 | 0.00 | Apr 7, 2025 | Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request. | ||
| CVE-2025-21428 | Hig | 0.49 | 7.5 | 0.00 | Apr 7, 2025 | Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request from the AP to establish a TSpec session. | ||
| CVE-2023-28588 | Hig | 0.49 | 7.5 | 0.01 | Dec 5, 2023 | Transient DOS in Bluetooth Host while rfc slot allocation. | ||
| CVE-2022-40521 | Hig | 0.49 | 7.5 | 0.00 | Jun 6, 2023 | Transient DOS due to improper authorization in Modem | ||
| CVE-2023-33070 | Hig | 0.46 | 7.1 | 0.00 | Dec 5, 2023 | Transient DOS in Automotive OS due to improper authentication to the secure IO calls. | ||
| CVE-2023-28554 | Med | 0.40 | 6.1 | 0.00 | Nov 7, 2023 | Information Disclosure in Qualcomm IPC while reading values from shared memory in VM. | ||
| CVE-2023-28586 | Med | 0.39 | 6.0 | 0.00 | Dec 5, 2023 | Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. | ||
| CVE-2024-33043 | Med | 0.36 | 5.5 | 0.00 | Sep 2, 2024 | Transient DOS while handling PS event when Program Service name length offset value is set to 255. |
- risk 0.51cvss 7.8epss 0.00
Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.
- risk 0.51cvss 7.8epss 0.00
Memory corruption in MPP performance while accessing DSM watermark using external memory address.
- risk 0.51cvss 7.8epss 0.00
Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer.
- risk 0.49cvss 7.5epss 0.00
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.
- risk 0.49cvss 7.5epss 0.00
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.
- risk 0.49cvss 7.5epss 0.00
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request from the AP to establish a TSpec session.
- risk 0.49cvss 7.5epss 0.01
Transient DOS in Bluetooth Host while rfc slot allocation.
- risk 0.49cvss 7.5epss 0.00
Transient DOS due to improper authorization in Modem
- risk 0.46cvss 7.1epss 0.00
Transient DOS in Automotive OS due to improper authentication to the secure IO calls.
- risk 0.40cvss 6.1epss 0.00
Information Disclosure in Qualcomm IPC while reading values from shared memory in VM.
- risk 0.39cvss 6.0epss 0.00
Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.
- risk 0.36cvss 5.5epss 0.00
Transient DOS while handling PS event when Program Service name length offset value is set to 255.
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