Mdm9655 Firmware
by Qualcomm
CVEs (169)
| CVE | Vendor / Product | Sev | Risk | CVSS | EPSS | KEV | Published | Description |
|---|---|---|---|---|---|---|---|---|
| CVE-2017-18324 | Med | 0.36 | 5.5 | 0.00 | Jan 3, 2019 | Cryptographic key material leaked in debug messages - GERAN in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD… | ||
| CVE-2017-18323 | Med | 0.36 | 5.5 | 0.00 | Jan 3, 2019 | Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD… | ||
| CVE-2017-18322 | Med | 0.36 | 5.5 | 0.00 | Jan 3, 2019 | Cryptographic key material leaked in WCDMA debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD… | ||
| CVE-2017-18321 | Med | 0.36 | 5.5 | 0.00 | Jan 3, 2019 | Security keys used by the terminal and NW for a session could be leaked in snapdragon mobile in versions MDM9650, MDM9655, SD 835, SDA660. | ||
| CVE-2017-18319 | Med | 0.36 | 5.5 | 0.00 | Jan 3, 2019 | Information leak in UIM API debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625,… | ||
| CVE-2017-11004 | Med | 0.36 | 5.5 | 0.00 | Jan 3, 2019 | A non-secure user may be able to access certain registers in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD… | ||
| CVE-2018-13907 | Med | 0.35 | 5.3 | 0.01 | Jun 14, 2019 | While deserializing any key blob during key operations, buffer overflow could occur, exposing partial key information if any key operations are invoked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon… | ||
| CVE-2018-11935 | Med | 0.35 | 5.3 | 0.01 | Feb 25, 2019 | Improper input validation might result in incorrect app id returned to the caller Instead of returning failure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT,… | ||
| CVE-2020-11293 | Med | 0.33 | 5.1 | 0.00 | May 7, 2021 | Out of bound read can happen in Widevine TA while copying data to buffer from user data due to lack of check of buffer length received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon… |
- risk 0.36cvss 5.5epss 0.00
Cryptographic key material leaked in debug messages - GERAN in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD…
- risk 0.36cvss 5.5epss 0.00
Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD…
- risk 0.36cvss 5.5epss 0.00
Cryptographic key material leaked in WCDMA debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD…
- risk 0.36cvss 5.5epss 0.00
Security keys used by the terminal and NW for a session could be leaked in snapdragon mobile in versions MDM9650, MDM9655, SD 835, SDA660.
- risk 0.36cvss 5.5epss 0.00
Information leak in UIM API debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625,…
- risk 0.36cvss 5.5epss 0.00
A non-secure user may be able to access certain registers in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD…
- risk 0.35cvss 5.3epss 0.01
While deserializing any key blob during key operations, buffer overflow could occur, exposing partial key information if any key operations are invoked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon…
- risk 0.35cvss 5.3epss 0.01
Improper input validation might result in incorrect app id returned to the caller Instead of returning failure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT,…
- risk 0.33cvss 5.1epss 0.00
Out of bound read can happen in Widevine TA while copying data to buffer from user data due to lack of check of buffer length received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon…
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