VYPR

Sd 650 Firmware

by Qualcomm

CVEs (115)

  • CVE-2018-11931HigFeb 25, 2019
    risk 0.51cvss 7.8epss 0.00

    Improper access to HLOS is possible while transferring memory to CPZ in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in…

  • CVE-2018-11289HigFeb 25, 2019
    risk 0.51cvss 7.8epss 0.00

    Data truncation during higher to lower type conversion which causes less memory allocation than desired can lead to a buffer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT,…

  • CVE-2018-13888HigFeb 11, 2019
    risk 0.51cvss 7.8epss 0.00

    There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607,…

  • CVE-2018-11899HigFeb 11, 2019
    risk 0.51cvss 7.8epss 0.00

    While processing radio connection status change events, Radio index is not properly validated in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile and Snapdragon Voice & Music in versions MDM9206, MDM9607, MDM9640,…

  • CVE-2018-11888HigFeb 11, 2019
    risk 0.51cvss 7.8epss 0.00

    Unauthorized access may be allowed by the SCP11 Crypto Services TA will processing commands from other TA in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon…

  • CVE-2018-11847HigFeb 11, 2019
    risk 0.51cvss 7.8epss 0.00

    Malicious TA can tag QSEE kernel memory and map to EL0, there by corrupting the physical memory as well it can be used to corrupt the QSEE kernel and compromise the whole TEE in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics…

  • CVE-2018-5867HigJan 18, 2019
    risk 0.51cvss 7.8epss 0.00

    Lack of checking input size can lead to buffer overflow In WideVine in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD…

  • CVE-2017-8276HigJan 18, 2019
    risk 0.51cvss 7.8epss 0.00

    Improper authorization involving a fuse in TrustZone in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD…

  • CVE-2017-18330HigJan 3, 2019
    risk 0.51cvss 7.8epss 0.00

    Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425,…

  • CVE-2017-18329HigJan 3, 2019
    risk 0.51cvss 7.8epss 0.00

    Possible Buffer overflow when transmitting an RTP packet in snapdragon automobile and snapdragon wear in versions MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415,…

  • CVE-2017-18320HigJan 3, 2019
    risk 0.51cvss 7.8epss 0.00

    QSEE unload attempt on a 3rd party TEE without previously loading results in a data abort in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD…

  • CVE-2017-18141HigJan 3, 2019
    risk 0.51cvss 7.8epss 0.00

    When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions…

  • CVE-2018-5918HigNov 28, 2018
    risk 0.51cvss 7.8epss 0.00

    Possible buffer overflow in DRM Trusted application due to lack of check function return values in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD…

  • CVE-2018-11921HigNov 28, 2018
    risk 0.51cvss 7.8epss 0.00

    Failure condition is not handled properly and the correct error code is not returned. It could cause unintended SUI behavior and create unintended SUI display in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD…

  • CVE-2018-11264HigNov 28, 2018
    risk 0.51cvss 7.8epss 0.00

    Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD…

  • CVE-2018-5914HigOct 26, 2018
    risk 0.51cvss 7.8epss 0.00

    Improper input validation in TZ led to array out of bound in TZ function while accessing the peripheral details using the incoming data in Snapdragon Mobile, Snapdragon Wear version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD…

  • CVE-2018-11849HigOct 26, 2018
    risk 0.51cvss 7.8epss 0.00

    Lack of check on out of range of bssid parameter When processing scan start command will lead to buffer flow in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MSM8996AU, QCA4531, QCA6174A, QCA6564,…

  • CVE-2017-18310HigOct 26, 2018
    risk 0.51cvss 7.8epss 0.00

    ClientEnv exposes services 0-32 to HLOS in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD…

  • CVE-2018-5838HigJul 6, 2018
    risk 0.51cvss 7.8epss 0.00

    Improper Validation of Array Index In the adreno OpenGL driver in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, an out-of-bounds access can occur in SurfaceFlinger.

  • CVE-2018-11258HigJul 6, 2018
    risk 0.51cvss 7.8epss 0.00

    In ADSP RPC in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, a Use After Free condition can occur in versions MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD…

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