VYPR

Sm4125 Firmware

by Qualcomm

CVEs (228)

  • CVE-2020-11204HigFeb 22, 2021
    risk 0.51cvss 7.8epss 0.00

    Possible memory corruption and information leakage in sub-system due to lack of check for validity and boundary compliance for parameters that are read from shared MSG RAM in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon…

  • CVE-2020-11195HigFeb 22, 2021
    risk 0.51cvss 7.8epss 0.00

    Out of bound write and read in TA while processing command from NS side due to improper length check on command and response buffers in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon…

  • CVE-2020-11194HigFeb 22, 2021
    risk 0.51cvss 7.8epss 0.00

    Possible out of bound access in TA while processing a command from NS side due to improper length check of response buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired…

  • CVE-2020-11127HigNov 12, 2020
    risk 0.51cvss 7.8epss 0.00

    u'Integer overflow can cause a buffer overflow due to lack of table length check in the extensible boot Loader during the validation of security metadata while processing objects to be loaded' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial…

  • CVE-2023-21652HigAug 8, 2023
    risk 0.50cvss 7.7epss 0.00

    Cryptographic issue in HLOS as derived keys used to encrypt/decrypt information is present on stack after use.

  • CVE-2021-35116HigJun 14, 2022
    risk 0.50cvss 7.7epss 0.00

    APK can load a crafted model into the CDSP which can lead to a compromise of CDSP and other APK`s data executing there in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables

  • CVE-2025-27066HigAug 6, 2025
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while processing an ANQP message.

  • CVE-2025-21454HigJul 8, 2025
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while processing received beacon frame.

  • CVE-2025-21449HigJul 8, 2025
    risk 0.49cvss 7.5epss 0.00

    Transient DOS may occur while processing malformed length field in SSID IEs.

  • CVE-2025-21430HigApr 7, 2025
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.

  • CVE-2025-21429HigApr 7, 2025
    risk 0.49cvss 7.5epss 0.00

    Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.

  • CVE-2024-33051HigSep 2, 2024
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while processing TIM IE from beacon frame as there is no check for IE length.

  • CVE-2024-33014HigAug 5, 2024
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while parsing ESP IE from beacon/probe response frame.

  • CVE-2024-21477HigMay 6, 2024
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while parsing a protected 802.11az Fine Time Measurement (FTM) frame.

  • CVE-2023-43536HigFeb 6, 2024
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while parse fils IE with length equal to 1.

  • CVE-2023-43533HigFeb 6, 2024
    risk 0.49cvss 7.5epss 0.00

    Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame.

  • CVE-2023-43522HigFeb 6, 2024
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL.

  • CVE-2023-43511HigJan 2, 2024
    risk 0.49cvss 7.5epss 0.00

    Transient DOS while parsing IPv6 extension header when WLAN firmware receives an IPv6 packet that contains `IPPROTO_NONE` as the next header.

  • CVE-2023-33062HigJan 2, 2024
    risk 0.49cvss 7.5epss 0.00

    Transient DOS in WLAN Firmware while parsing a BTM request.

  • CVE-2023-28588HigDec 5, 2023
    risk 0.49cvss 7.5epss 0.01

    Transient DOS in Bluetooth Host while rfc slot allocation.

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