Snapdragon 670 Mobile Firmware
by Qualcomm
CVEs (27)
| CVE | Vendor / Product | Sev | Risk | CVSS | EPSS | KEV | Published | Description |
|---|---|---|---|---|---|---|---|---|
| CVE-2025-21454 | Hig | 0.49 | 7.5 | 0.00 | Jul 8, 2025 | Transient DOS while processing received beacon frame. | ||
| CVE-2025-21449 | Hig | 0.49 | 7.5 | 0.00 | Jul 8, 2025 | Transient DOS may occur while processing malformed length field in SSID IEs. | ||
| CVE-2023-43548 | Hig | 0.47 | 7.3 | 0.00 | Mar 4, 2024 | Memory corruption while parsing qcp clip with invalid chunk data size. | ||
| CVE-2025-21422 | Hig | 0.46 | 7.1 | 0.00 | Jul 8, 2025 | Cryptographic issue while processing crypto API calls, missing checks may lead to corrupted key usage or IV reuses. | ||
| CVE-2025-21433 | Med | 0.40 | 6.2 | 0.00 | Jul 8, 2025 | Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus. | ||
| CVE-2023-43530 | Med | 0.38 | 5.9 | 0.00 | May 6, 2024 | Memory corruption in HLOS while checking for the storage type. | ||
| CVE-2024-53009 | Med | 0.34 | 5.3 | 0.00 | Jul 8, 2025 | Memory corruption while operating the mailbox in Automotive. |
- risk 0.49cvss 7.5epss 0.00
Transient DOS while processing received beacon frame.
- risk 0.49cvss 7.5epss 0.00
Transient DOS may occur while processing malformed length field in SSID IEs.
- risk 0.47cvss 7.3epss 0.00
Memory corruption while parsing qcp clip with invalid chunk data size.
- risk 0.46cvss 7.1epss 0.00
Cryptographic issue while processing crypto API calls, missing checks may lead to corrupted key usage or IV reuses.
- risk 0.40cvss 6.2epss 0.00
Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus.
- risk 0.38cvss 5.9epss 0.00
Memory corruption in HLOS while checking for the storage type.
- risk 0.34cvss 5.3epss 0.00
Memory corruption while operating the mailbox in Automotive.
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