VYPR

Qcs8155 Firmware

by Qualcomm

CVEs (41)

  • CVE-2023-33107HigKEVDec 5, 2023
    risk 0.67cvss 8.4epss 0.01

    Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call.

  • CVE-2023-33032CriJan 2, 2024
    risk 0.60cvss 9.3epss 0.00

    Memory corruption in TZ Secure OS while requesting a memory allocation from TA region.

  • CVE-2023-33030CriJan 2, 2024
    risk 0.60cvss 9.3epss 0.00

    Memory corruption in HLOS while running playready use-case.

  • CVE-2024-33056HigDec 2, 2024
    risk 0.55cvss 8.4epss 0.00

    Memory corruption when allocating and accessing an entry in an SMEM partition continuously.

  • CVE-2024-21468HigApr 1, 2024
    risk 0.55cvss 8.4epss 0.00

    Memory corruption when there is failed unmap operation in GPU.

  • CVE-2023-24852HigNov 7, 2023
    risk 0.55cvss 8.4epss 0.00

    Memory Corruption in Core due to secure memory access by user while loading modem image.

  • CVE-2023-24853HigOct 3, 2023
    risk 0.55cvss 8.4epss 0.00

    Memory Corruption in HLOS while registering for key provisioning notify.

  • CVE-2023-28538HigSep 5, 2023
    risk 0.55cvss 8.4epss 0.00

    Memory corruption in WIN Product while invoking WinAcpi update driver in the UEFI region.

  • CVE-2022-40520HigJan 9, 2023
    risk 0.55cvss 8.4epss 0.01

    Memory corruption due to stack-based buffer overflow in Core

  • CVE-2022-25724HigNov 15, 2022
    risk 0.55cvss 8.4epss 0.00

    Memory corruption in graphics due to buffer overflow while validating the user address in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

  • CVE-2021-30318HigFeb 11, 2022
    risk 0.55cvss 8.4epss 0.00

    Improper validation of input when provisioning the HDCP key can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables

  • CVE-2023-28585HigDec 5, 2023
    risk 0.53cvss 8.2epss 0.00

    Memory corruption while loading an ELF segment in TEE Kernel.

  • CVE-2025-27053HigOct 9, 2025
    risk 0.51cvss 7.8epss 0.00

    Memory corruption during PlayReady APP usecase while processing TA commands.

  • CVE-2025-27062HigAug 6, 2025
    risk 0.51cvss 7.8epss 0.00

    Memory corruption while handling client exceptions, allowing unauthorized channel access.

  • CVE-2025-27042HigJul 8, 2025
    risk 0.51cvss 7.8epss 0.00

    Memory corruption while processing video packets received from video firmware.

  • CVE-2024-49844HigMay 6, 2025
    risk 0.51cvss 7.8epss 0.00

    Memory corruption while triggering commands in the PlayReady Trusted application.

  • CVE-2025-21424HigMar 3, 2025
    risk 0.51cvss 7.8epss 0.00

    Memory corruption while calling the NPU driver APIs concurrently.

  • CVE-2023-43542HigJun 3, 2024
    risk 0.51cvss 7.8epss 0.00

    Memory corruption while copying a keyblob`s material when the key material`s size is not accurately checked.

  • CVE-2024-21475HigMay 6, 2024
    risk 0.51cvss 7.8epss 0.00

    Memory corruption when the payload received from firmware is not as per the expected protocol size.

  • CVE-2023-33017HigDec 5, 2023
    risk 0.51cvss 7.8epss 0.00

    Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.

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