MSM Thermal driver
by Qualcomm
CVEs (1)
| CVE | Vendor / Product | Sev | Risk | CVSS | EPSS | KEV | Published | Description |
|---|---|---|---|---|---|---|---|---|
| CVE-2016-2063 | Hig | 0.51 | 7.8 | 0.00 | Aug 7, 2016 | Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to… |
- risk 0.51cvss 7.8epss 0.00
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to…