High severity7.8NVD Advisory· Published Aug 7, 2016· Updated Jun 17, 2026
CVE-2016-2063
CVE-2016-2063
Description
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
Affected products
5- Range: kernel 3.x
- osv-coords3 versionspkg:deb/ubuntu/linux-flo@3.4.0-5.23?arch=source&distro=esm-apps/xenialpkg:deb/ubuntu/linux-goldfish@3.4.0-4.27?arch=source&distro=esm-apps/xenialpkg:deb/ubuntu/linux-mako@3.4.0-7.44?arch=source&distro=esm-apps/xenial
>= 0+ 2 more
- (no CPE)range: >= 0
- (no CPE)range: >= 0
- (no CPE)range: >= 0
Patches
Vulnerability mechanics
References
3- us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/nvdMailing ListPatchThird Party Advisory
- www.securityfocus.com/bid/92381nvdThird Party AdvisoryVDB Entry
- www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063nvdBroken Link
News mentions
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