Medium severity6.7NVD Advisory· Published Jan 3, 2022· Updated Jun 17, 2026
CVE-2021-30298
CVE-2021-30298
Description
Possible out of bound access due to improper validation of item size and DIAG memory pools data while switching between USB and PCIE interface in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Affected products
63- cpe:2.3:o:qualcomm:ar8031_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:csra6620_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:csra6640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fsm10055_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:fsm10056_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ipq8072a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ipq8074a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ipq8076a_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6390_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6595au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca6696_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca8337_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9000_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn9074_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs410_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qrb5165_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qrb5165n_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qualcomm215_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa8155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd205_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd210_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd460_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd662_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd665_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd765_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd765g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd768g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd865_5g_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd870_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda429w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7250p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9335_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9340_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9341_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3610_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3620_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3660b_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3991_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3998_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn3999_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wcn6851_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*+ 1 more
- cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8815_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:*
- Qualcomm, Inc./Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networkingv5Range: AR8031, AR8035, CSRA6620, CSRA6640, FSM10055, FSM10056, IPQ8072A, IPQ8074A, IPQ8076A, MDM9150, QCA6390, QCA6391, QCA6574AU, QCA6595AU, QCA6696, QCA8337, QCN9000, QCN9074, QCS405, QCS410, QCS610, QRB5165, QRB5165N, Qualcomm215, SA8155P, SD205, SD210, SD460, SD662, SD665, SD765, SD765G, SD768G, SD865 5G, SD870, SDA429W, SDX55, SDX55M, SM7250P, WCD9335, WCD9340, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3610, WCN3620, WCN3660B, WCN3950, WCN3980, WCN3988, WCN3991, WCN3998, WCN3999, WCN6850, WCN6851, WSA8810, WSA8815, WSA8830, WSA8835
Patches
Vulnerability mechanics
References
1- www.qualcomm.com/company/product-security/bulletins/december-2021-bulletinnvdPatchVendor Advisory
News mentions
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