High severity7.8NVD Advisory· Published Dec 12, 2019· Updated Jun 17, 2026
CVE-2019-2288
CVE-2019-2288
Description
Out of bound write in TZ while copying the secure dump structure on HLOS provided buffer as a part of memory dump in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8976, MSM8996, MSM8996AU, MSM8998, QCA8081, QCS605, QM215, SDA660, SDA845, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, Snapdragon_High_Med_2016, SXR1130
Affected products
42- cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8017_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8096_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8098_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8905_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8909_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8917_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8920_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8937_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8940_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8953_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8976_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8996_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8998_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qm215_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm450_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*
- Qualcomm, Inc./Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networkingv5Range: APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8976, MSM8996, MSM8996AU, MSM8998, QCA8081, QCS605, QM215, SDA660, SDA845, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, Snapdragon_High_Med_2016, SXR1130
Patches
Vulnerability mechanics
References
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