Unrated severityNVD Advisory· Published Feb 12, 2020· Updated Aug 5, 2024
CVE-2019-19196
CVE-2019-19196
Description
The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an attacker in radio range to cause a buffer overflow and denial of service (crash) via crafted packets.
AI Insight
LLM-synthesized narrative grounded in this CVE's description and references.
Affected products
2- Telink Semiconductor/BLE SDKdescription
- Range: < November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, TLSR826x through 3.3
Patches
Vulnerability mechanics
No source-code context for this CVE — mechanics is only generated when we can read the actual fix diff. Without that, the four sections (root cause, attack vector, affected code, fix) would be speculation rather than analysis.
References
2- www.telink-semi.com/blemitrex_refsource_MISC
- asset-group.github.io/disclosures/sweyntooth/mitrex_refsource_MISC
News mentions
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