Medium severity6.5NVD Advisory· Published Feb 12, 2020· Updated Jun 17, 2026

CVE-2019-19196

Description

The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an attacker in radio range to cause a buffer overflow and denial of service (crash) via crafted packets.

AI Insight

LLM-synthesized narrative grounded in this CVE's description and references.

Affected products

Telink Semi/Tlsr8232 Ble SDK
cpe:2.3:a:telink-semi:tlsr8232_ble_sdk:*:*:*:*:*:*:*:*
Range: <=1.3.0
Telink Semi/Tlsr8251 Ble SDK
cpe:2.3:a:telink-semi:tlsr8251_ble_sdk:*:*:*:*:*:*:*:*
Range: <=3.4.0
Telink Semi/Tlsr8253 Ble SDK
cpe:2.3:a:telink-semi:tlsr8253_ble_sdk:*:*:*:*:*:*:*:*
Range: <=3.4.0
Telink Semi/Tlsr8258 Ble SDK
cpe:2.3:a:telink-semi:tlsr8258_ble_sdk:*:*:*:*:*:*:*:*
Range: <=3.4.0
Telink Semi/Tlsr8269 Ble SDK
cpe:2.3:a:telink-semi:tlsr8269_ble_sdk:*:*:*:*:*:*:*:*
Range: <=3.3
Telink Semiconductor/BLE SDKdescription
Telink Semiconductor/BLE SDKllm-fuzzy
Range: < November 2019

cvss	0.423
epss	0.001
exploit	0.000
kev	0.000
patch	0.000
ransomware	0.000

CVE-2019-19196

Description

AI Insight

Affected products

Patches

Vulnerability mechanics

References

News mentions