VYPR
Unrated severityNVD Advisory· Published Nov 14, 2019· Updated Aug 5, 2024

CVE-2019-15372

CVE-2019-15372

Description

The Hisense F17 Android device with a build fingerprint of Hisense/F17_4G/HS6739MT:8.1.0/O11019/Hisense_F17_4G_00_S01:user/release-keys contains a pre-installed app with a package name of com.mediatek.wfo.impl app (versionCode=27, versionName=8.1.0) that allows any app co-located on the device to modify a system property through an exported interface without proper authorization.

AI Insight

LLM-synthesized narrative grounded in this CVE's description and references.

Affected products

2
  • Hisense/F17description
  • Hisense/F17llm-create
    Range: Android 8.1.0 (build fingerprint Hisense/F17_4G/HS6739MT:8.1.0/O11019/Hisense_F17_4G_00_S01:user/release-keys)

Patches

Vulnerability mechanics

No source-code context for this CVE — mechanics is only generated when we can read the actual fix diff. Without that, the four sections (root cause, attack vector, affected code, fix) would be speculation rather than analysis.

References

1

News mentions

0

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