High severity7.8NVD Advisory· Published Apr 16, 2020· Updated Jun 17, 2026
CVE-2019-14021
CVE-2019-14021
Description
Possible buffer overrun when processing EFS filename and payload sent over diag interface due to lack of check for filename length and payload size received in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8096AU, APQ8098, MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130
Affected products
47- cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8098_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8905_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8909_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8917_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8920_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8937_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8940_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8953_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8998_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:nicobar_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm2150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qm215_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:rennell_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sc7180_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm429w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm450_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*
- Qualcomm, Inc./Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearablesv5Range: APQ8096AU, APQ8098, MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130
Patches
Vulnerability mechanics
References
1- www.qualcomm.com/company/product-security/bulletins/april-2020-bulletinnvdVendor Advisory
News mentions
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