CVE-2019-13995
Description
u'Lack of integer overflow check for addition of fragment size and remaining size that are read from shared memory can lead to memory corruption and potential information leakage' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, Bitra, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA6155P, Saipan, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
Affected products
67- cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8017_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8098_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:bitra_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ipq6018_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:kamorta_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9205_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8905_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8909_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8917_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8920_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8937_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8940_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8953_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8996_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8998_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:nicobar_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcm2150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcn7605_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs404_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs610_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qm215_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:rennell_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa415m_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sa6155p_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:saipan_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sc7180_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm429w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm450_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm670_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm850_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8250_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr2130_firmware:-:*:*:*:*:*:*:*
- Qualcomm, Inc./Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networkingv5Range: APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, Bitra, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA6155P, Saipan, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
Patches
Vulnerability mechanics
References
2News mentions
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