High severity7.1NVD Advisory· Published Apr 16, 2020· Updated Jun 17, 2026
CVE-2019-10625
CVE-2019-10625
Description
Out of bound access in diag services when DCI command buffer reallocation is not done properly with required capacity in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8009, APQ8096AU, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, QCS605, Rennell, SC8180X, SDM429W, SDM710, SDX55, SM7150, SM8150
Affected products
17- cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9207c_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:rennell_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm429w_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm710_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*
- Qualcomm, Inc./Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearablesv5Range: APQ8009, APQ8096AU, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, QCS605, Rennell, SC8180X, SDM429W, SDM710, SDX55, SM7150, SM8150
Patches
Vulnerability mechanics
References
1- www.qualcomm.com/company/product-security/bulletins/april-2020-bulletinnvdPatchVendor Advisory
News mentions
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