Unrated severityNVD Advisory· Published Mar 5, 2020· Updated Aug 4, 2024
CVE-2019-10612
CVE-2019-10612
Description
UTCB object has a function pointer called by the reaper to deallocate its memory resources and this address can potentially be corrupted by stack overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
Affected products
2- Qualcomm, Inc./Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networkingv5Range: MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
Patches
Vulnerability mechanics
References
1- www.qualcomm.com/company/product-security/bulletins/march-2020-bulletinmitrex_refsource_CONFIRM
News mentions
0No linked articles in our index yet.