High severity7.8NVD Advisory· Published Mar 5, 2020· Updated Jun 17, 2026
CVE-2019-10569
CVE-2019-10569
Description
Stack buffer overflow due to instance id is misplaced inside definition of hardware accelerated effects in makefile in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile in APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130
Affected products
20- cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:apq8098_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:msm8998_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sc8180x_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sdx55_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm6150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm7150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:*
- Qualcomm, Inc./Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobilev5Range: APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130
Patches
Vulnerability mechanics
References
1- www.qualcomm.com/company/product-security/bulletins/march-2020-bulletinnvdPatchVendor Advisory
News mentions
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