High severity7.8NVD Advisory· Published Sep 20, 2018· Updated Jun 17, 2026
CVE-2018-11277
CVE-2018-11277
Description
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
Affected products
2- Qualcomm, Inc./Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wearv5Range: MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660
Patches
Vulnerability mechanics
References
1- www.qualcomm.com/company/product-security/bulletinsnvdVendor Advisory
News mentions
0No linked articles in our index yet.