High severity7.0NVD Advisory· Published Oct 23, 2018· Updated Jun 17, 2026
CVE-2017-18305
CVE-2017-18305
Description
XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835.
AI Insight
LLM-synthesized narrative grounded in this CVE's description and references.
Affected products
10- cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
- Qualcomm, Inc./Snapdragon Mobile, Snapdragon Wearv5Range: MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835
Patches
Vulnerability mechanics
References
3- www.securitytracker.com/id/1041432nvdThird Party AdvisoryVDB Entry
- source.android.com/security/bulletin/2018-08-01nvdThird Party Advisory
- www.qualcomm.com/company/product-security/bulletinsnvdVendor Advisory
News mentions
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