High severity7.8NVD Advisory· Published Oct 23, 2018· Updated Jun 17, 2026
CVE-2017-18297
CVE-2017-18297
Description
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.
AI Insight
LLM-synthesized narrative grounded in this CVE's description and references.
Affected products
9- cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
- cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
- Qualcomm, Inc./Snapdragon Mobilev5Range: SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820
Patches
Vulnerability mechanics
References
3- www.securitytracker.com/id/1041432nvdThird Party AdvisoryVDB Entry
- source.android.com/security/bulletin/2018-08-01nvdThird Party Advisory
- www.qualcomm.com/company/product-security/bulletinsnvdVendor Advisory
News mentions
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